A good example to show the precision of our machining are Durostone® PCB solder pallets. They are used to fix electronic components on printed circuit boads using the wave soldering process. The design of the solder pallets is exactly adjusted to the design of the printed circute board.
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Durostone® PCB solder pallets
Durostone® PCB Solder Pallet Materials
Durostone® materials have been developed for all procedures within the PCB assembly process. There are three main grades which are suitable for use in the SMT reflow and wave soldering processes, Durostone® CHP760, CAS761 & CAG762.
These materials offer the following features:
- Excellent mechanical properties at elevated temperatures including the lead-free process.
- Low thermal conductivity.
- Excellent machining properties enabling the manufacture of complex design solder pallets.
- Good resistance to chemicals used in modern fluxes.
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Durostone® Solder pallets
Harsh environments
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Durostone® Solder pallets - perfectly machined
Durostone® WGR781 is a woven glass laminate which has been specially formulated to withstand extreme temperatures and aggressive fluxes. Fluxes containing halides or halogen activators can reduce a material´s lifespan, but Durostone® WGR781 can run many thousands of cycles without any adverse effect. The woven glass reinforcement ensures that the flux does not penetrate the solder pallet surface and expose fibres.
The resin used to produce Durostone® WGR781 can operate at a continous temperature of 280°C without degradation. The material also displays excellent mechanically properties and provides the necessary dimensional stability at elevated temperatures in the wave soldering process. Durostone® WGR781 has excellent machining properties, with walls of just 0.50 mm thick possible.
