SustaPEEK CF 30 - ASTM
PEEK
Characteristics
- Low coefficient of thermal expansion
- High rigidity
- High stiffness
- Good dimensional stability
Industries
Semiconductor Wafer Handling
Technical Specifications SustaPEEK CF 30 - ASTM
| Test Method | Unit | Guideline Value | |
|---|---|---|---|
| Density | ASTM D792 | g / cm3 | 1.41 |
| Water Absorption 24 hours | ASTM D570 | % | 0.06 |
| Water Absorption Saturation | ASTM D570 | % | 0.3 |
| Test Method | Unit | Guideline Value | |
|---|---|---|---|
| Hardness | ASTM D2240 | Shore D | 93 |
| Tensile Strength at yield 73°F | ASTM D638 | psi | 20000 |
| Tensile Modulus | ASTM D638 | psi | 1000000 |
| Elongation at Break | ASTM D638 | % | 5 |
| Flexural Strength | ASTM D790 | psi | 25000 |
| Flexural Modulus | ASTM D790 | psi | 1300000 |
| Compressive Strength | ASTM D695 | psi | 29000 |
| Rockwell Hardness | ASTM D785 | 102 | |
| Rockwell Hardness | ASTM D785 | R | 124 |
| Izod Impact, Notched | ASTM D256 | ft-lb/in | 1 |
| Coefficient of Friction, Dynamic | 0.2 |
| Test Method | Unit | Guideline Value | |
|---|---|---|---|
| Thermal Conductivity | in/hr/ft2 /°F | 6.3 | |
| Coefficient of Linear Thermal Expansion | ASTM D696 | in/in/°F x10-5 | 1 |
| Melting Point | ASTM D789 | °F | 645 |
| Continuous Service Temperature, Air | °F | 480 | |
| Deflection Temperature at 1.8Mpa (264psi) | ASTM D648 | °F | 520 |
| Flammability, UL94 | 1/8 inch | V-0 |
| Test Method | Unit | Guideline Value | |
|---|---|---|---|
| Dielectric constant | ASTM D150 | 1MHz | 3.3 |
| Dielectric strength | ASTM D149 | V/mil | 32 |
| Surface resistivity | ASTM D257 | Ω/cm | 105 |
| Test Method | Unit | Guideline Value | |
|---|---|---|---|
| FDA | No | ||
| NSF | No | ||
| USDA | No |
