SustaPEI - ASTM
PEI
Characteristics
- High stiffness even at high temperatures
- Low smoke development
- Good resistance against high energy radiation
Industries
Semiconductor Wafer Handling- Semiconductor High and low temperature
- Semiconductor Back-End applications
Technical Specifications SustaPEI - ASTM
| Test Method | Unit | Guideline Value | |
|---|---|---|---|
| Density | ASTM D792 | g / cm3 | 1.27 |
| Water Absorption 24 hours | ASTM D570 | % | 0.25 |
| Dissipation Factor | ASTM D150 | 1MHz | 0.001 |
| Water Absorption Saturation | ASTM D570 | % | 1.25 |
| Test Method | Unit | Guideline Value | |
|---|---|---|---|
| Hardness | ASTM D2240 | Shore D | 86 |
| Tensile Strength at yield 73°F | ASTM D638 | psi | 16700 |
| Tensile Modulus | ASTM D638 | psi | 480000 |
| Elongation at Break | ASTM D638 | % | 60* |
| Flexural Strength | ASTM D790 | psi | 20000 |
| Flexural Modulus | ASTM D790 | psi | 500000 |
| Compressive Strength | ASTM D695 | psi | 22000 |
| Rockwell Hardness | ASTM D785 | 114 | |
| Rockwell Hardness | ASTM D785 | R | 123 |
| Shear Strength | ASTM D732 | psi | 15000 |
| Izod Impact, Notched | ASTM D256 | ft-lb/in | 0.6 |
| Coefficient of Friction, Dynamic | 0.2 |
| Test Method | Unit | Guideline Value | |
|---|---|---|---|
| Thermal Conductivity | in/hr/ft2 /°F | 1 | |
| Coefficient of Linear Thermal Expansion | ASTM D696 | in/in/°F x10-5 | 3.1 |
| Melting Point | ASTM D789 | °F | 460 |
| Continuous Service Temperature, Air | °F | 340 | |
| Deflection Temperature at 1.8Mpa (264psi) | ASTM D648 | °F | 395 |
| Deflection Temperature at 1.8Mpa (66psi) | ASTM D648 | °F | 405 |
| Flammability, UL94 | 1/8 inch | V-0 |
| Test Method | Unit | Guideline Value | |
|---|---|---|---|
| Dielectric constant | ASTM D150 | 1MHz | 3.2 |
| Dielectric strength | ASTM D149 | V/mil | 830 |
| Surface resistivity | ASTM D257 | Ω/cm | >1013 |
| Test Method | Unit | Guideline Value | |
|---|---|---|---|
| FDA | Yes | ||
| NSF | No | ||
| USDA | Yes |
